| 摘要 |
The present invention relates to an optical device package and a method for producing the same. The optical device package comprises: an insulating layer including a through hole; a circuit pattern layer disposed on one side of the insulating layer; a heat radiating unit including a projection on the other side of the insulating layer to be stored in the through hole; and an optical device mounted on the projection. According to the present invention, the malfunction of an LED chip or semiconductor chips due to overheating and the damages to the chips can be prevented by directly mounting the chip acting as a heat source in the optical device package on the heat radiating unit directing releasing heat to effectively dissipate heat generated from the chip. According to the present invention, the light dissipating path of light from the optical device is prevented from blockage in the side surface of the optical device, increasing optical efficiency. [Reference numerals] (AA) Light absorbing area |
