| 摘要 |
A printed circuit board according to an embodiment of the present invention includes a base substrate, a circuit layer which is formed on the upper side of the base substrate and includes a connection pad, a solder resist layer which is formed on the upper sides of the circuit layer and the base substrate and includes an opening part to expose the connection pad, a bonding layer which is formed on the upper side of the connection pad exposed by the opening part, and a metal bump which is formed on the upper side of the bonding layer and protrudes from the solder resist layer. |
