| 摘要 |
Provided are a method for encapsulating an electronic device, and an encapsulated electronic device. The encapsulated electronic device includes a metal substrate, a SiO2 layer formed on the metal layer, an electronic device on the SiO2 layer, a glass film plate, and a glass frit sealing the electronic device and connected to the SiO2 layer and the glass thin plate. According to the present invention, the deterioration of the electronic device due to the penetration of gas and moisture is prevented and a flexible electronic device is provided. |
