发明名称 |
Method and system for controlling chemical mechanical polishing by controllably moving a slurry outlet |
摘要 |
A system and a method of operating a chemical mechanical polishing (CMP) system comprises a slurry delivering unit configured for locally varying the supply of slurry while polishing the substrate. To this end, the slurry delivering unit may comprise at least one slurry outlet over a polishing pad of the CMP system, wherein the at least one slurry outlet is controllably movable to distribute slurry over the polishing pad. |
申请公布号 |
US8622783(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201113157447 |
申请日期 |
2011.06.10 |
申请人 |
KIESEL AXEL;STOECKGEN UWE;LAMPETT JOHN;WUNDRAM HEIKO;ADVANCED MICRO DEVICES, INC. |
发明人 |
KIESEL AXEL;STOECKGEN UWE;LAMPETT JOHN;WUNDRAM HEIKO |
分类号 |
B24B1/00;B24B37/04;B24B49/00;B24B51/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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