PRINTED CIRCUIT BOARD AND FOR SMART IC MODULE HAVING THIS BOARD

摘要

The present invention relates to a printed circuit board and a smart IC module having the same. The printed circuit board for a smart IC comprises an insulative layer made of prepreg which is hardened at 180°C or at higher temperatures for four hours or more; and a circuit pattern layer on one side of the insulative layer. The surficial texture of the insulative layer which is made of prepreg is rough. Therefore, the adhesion of a molding part to the insulative layer is improved to prevent the molding part from easily coming off from the insulative layer using the rough surface of the insulative layer when the molding part is formed on the insulative layer. [Reference numerals] (AA) Conventional prepreg surface; (BB) Prepreg surface of the present invention