METHOD FOR PATTERNING CIRCUIT AND SUBSTRATE HAVING CIRCUIT PATTERN PRODUCED BY THE SAME

摘要

The present invention relates to a method for patterning a circuit and a substrate having a circuit pattern manufactured by the same, and an embodiment of the present invention provides a method for patterning a circuit and a circuit pattern manufactured by including: a step of hydrophobic surface treatment to form a hydrophobic surface treatment layer in a part of the substrate; a step of coating a thermally labile material on the hydrophobic surface-treated region; a step of coating conductive ink in a region except for the hydrophobic surface-treated region; and a step of thermal processing to remove the thermally labile material. According to the present invention, the method allows patterning under non-vacuum conditions and is capable of patterning tens to several hundred times faster than an existing electron beam etching technique.