发明名称 |
Methods for forming MEMS devices |
摘要 |
A method includes forming a Micro-Electro-Mechanical System (MEMS) device on a front surface of a substrate. After the step of forming the MEMS device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate. The through-opening is filled with a dielectric material, which insulates a first portion of the substrate from a second portion of the substrate. An electrical connection is formed on the backside of the substrate. The electrical connection is electrically coupled to the MEMS device through the first portion of the substrate. |
申请公布号 |
US8623768(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201113310422 |
申请日期 |
2011.12.02 |
申请人 |
LEE TE-HAO;HSIEH YUAN-CHIH;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LEE TE-HAO;HSIEH YUAN-CHIH |
分类号 |
H01L21/311 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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