发明名称 |
Reflow system and method for conductive connections |
摘要 |
A system and method for forming conductive connections is disclosed. An embodiment comprises forming conductive material on to contacts of a semiconductor substrate. The semiconductor substrate is then inverter such that the conductive material is beneath the semiconductor substrate, and the conductive material is reflowed to form a conductive bump. The reflow is performed using gravity in order to form a more uniform shape for the conductive bump. |
申请公布号 |
US8623756(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201113167257 |
申请日期 |
2011.06.23 |
申请人 |
CHUANG CHITA;WU SHENG-YU;KUO TIN-HAO;TSAI PEI-CHUN;CHENG MING-DA;CHEN CHEN-SHIEN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHUANG CHITA;WU SHENG-YU;KUO TIN-HAO;TSAI PEI-CHUN;CHENG MING-DA;CHEN CHEN-SHIEN |
分类号 |
H01L21/283 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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