发明名称 |
Adhesive/spacer island structure for multiple die package |
摘要 |
An adhesive/spacer structure (52, 52A, 60) is used to adhere first and second die (14, 18) to one another at a chosen separation in a multiple-die semiconductor chip package (56). The first and second die define a die bonding region (38) therebetween. The adhesive/spacer structure may comprise a plurality of spaced-apart adhesive/spacer islands (52, 52A) securing the first and second die to one another at a chosen separation (53). The adhesive/spacer structure may also secure the first and second die to one another to occupy about 1-50% of the die bonding region. |
申请公布号 |
US8623704(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US20060530841 |
申请日期 |
2006.09.11 |
申请人 |
LEE SANG HO;JU JONG WOOK;KWON HYEOG CHAN;CHIPPAC, INC. |
发明人 |
LEE SANG HO;JU JONG WOOK;KWON HYEOG CHAN |
分类号 |
H01L21/44;H01L21/48;H01L23/02;H01L23/495;H01L25/065 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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