| 摘要 |
PURPOSE: A semiconductor package sliming apparatus and a method thereof are provided to save polishing time by performing a rough polishing process and a normal polishing process separately. CONSTITUTION: A table (10) adsorbs a semiconductor package. A vacuum device applies vacuum to the table. A rough polishing grindstone (21) is positioned on one side of the table. A normal polishing grindstone (31) is positioned on the other side of the table. The rough polishing grindstone and the normal polishing grindstone are installed to both sides of the table respectively. |
