发明名称 Light emitting device package and method for fabricating the same
摘要 A light emitting device package comprises a substrate, an electrode on the substrate, a light emitting device on the substrate and electrically connected to the electrode layer, and a pattern enclosing the light emitting device.
申请公布号 US8624280(B2) 申请公布日期 2014.01.07
申请号 US20080674315 申请日期 2008.08.07
申请人 WON YU HO;KIM GEUN HO;LG INNOTEK CO., LTD. 发明人 WON YU HO;KIM GEUN HO
分类号 H01L29/72;H01L33/50;H01L33/54 主分类号 H01L29/72
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