| 摘要 |
The present invention relates to an apparatus and a method for processing a semiconductor wafer capable of filling a via hole of a wafer with a conductor. More specifically, the apparatus for processing a semiconductor wafer includes a wafer chuck supporting and fixing the backside of the wafer having a via hole; a chuck rotation part rotating the wafer chuck; a chamber surrounding the wafer fixated to the wafer chuck; and a heater transferring heat to a processing liquid supplied onto the wafer surrounded by the chamber. |
