发明名称 |
Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus |
摘要 |
A semiconductor package has a semiconductor chip, a lead frame in which a semiconductor chip is mounted on a die pad, and a resin sealing the semiconductor chip and the die pad from an upper surface and a lower surface, the resin has a concave portion disposed at the surface and a concave portion situated inside the concave portion in a plan view. |
申请公布号 |
US8623701(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US201113110409 |
申请日期 |
2011.05.18 |
申请人 |
NAGANO HISANORI;RENESAS ELECTRONICS CORPORATION |
发明人 |
NAGANO HISANORI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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