| 发明名称 |
Mock bump system for flip chip integrated circuits |
| 摘要 |
A mock bump system includes providing a flip chip integrated circuit having an edge and forming a mock bump near the edge. |
| 申请公布号 |
US8624402(B2) |
申请公布日期 |
2014.01.07 |
| 申请号 |
US20080055665 |
申请日期 |
2008.03.26 |
| 申请人 |
KIM YOUNGMIN;KIM BAEYONG;KANG HYUNCHUL;STATS CHIPPAC LTD |
发明人 |
KIM YOUNGMIN;KIM BAEYONG;KANG HYUNCHUL |
| 分类号 |
H01L23/48;H01L21/00 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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