发明名称 |
Device having a plurality of light emitting structures bonded by adhesive layers and light emitting device package having the same |
摘要 |
Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a first chip structure including a first reflective layer and a first light emitting structure having a plurality of compound semiconductor layers on the first reflective layer; a second chip structure bonded onto the first chip structure and including a second reflective layer and a second light emitting structure having a plurality of compound semiconductor layers on the second reflective layer; and an electrode on the second chip structure. |
申请公布号 |
US8624270(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US20100906856 |
申请日期 |
2010.10.18 |
申请人 |
PARK KYUNG WOOK;LG INNOTEK CO., LTD. |
发明人 |
PARK KYUNG WOOK |
分类号 |
H01L29/18;H01L21/00;H01L27/15;H01L33/00 |
主分类号 |
H01L29/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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