发明名称 Non-deleterious technique for creating continuous conductive circuits
摘要 A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.
申请公布号 US8621749(B2) 申请公布日期 2014.01.07
申请号 US201113035531 申请日期 2011.02.25
申请人 YI SHEN-HUNG;LIAO PEN-YI;TAIWAN GREEN POINT ENTERPRISES CO., LTD 发明人 YI SHEN-HUNG;LIAO PEN-YI
分类号 H01R43/00;H05K13/00 主分类号 H01R43/00
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