发明名称 |
Wafer edge exposure module |
摘要 |
A wafer edge exposure module connected to a semiconductor wafer track system. The wafer edge exposure module includes a wafer spin device, an optical system, a scanner interface module, and a controller. The wafer spin device supports a wafer for processing. The optical system directs exposure light on a respective edge portion of the wafer simultaneously to create a dummy track on the edge of the wafer. The scanner interface module sends and/or receives dummy edge exposure information from a scanner via a computer network. The controller receives the dummy edge exposure information from the scanner interface module and uses the exposure information to control the optical system. |
申请公布号 |
US8625076(B2) |
申请公布日期 |
2014.01.07 |
申请号 |
US20100702601 |
申请日期 |
2010.02.09 |
申请人 |
CHIEN TSUNG-CHIH;CHEN YUNG-CHENG;LEE HENG-JEN;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHIEN TSUNG-CHIH;CHEN YUNG-CHENG;LEE HENG-JEN |
分类号 |
G03B27/74;G03B27/42 |
主分类号 |
G03B27/74 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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