METHOD AND APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a flexible printed wiring board capable of enhancing an accuracy of an opening position in accordance with a progress of enhancing a density of the flexible printed wiring board. SOLUTION: The method for manufacturing the flexible printed circuit board comprises a perforating step of perforating an insulating tape board with an adhesive layer having flexibility, a laminating step of thermally press bonding the board with the adhesive layer to a copper foil, and a pattern etching step of removing by etching an exposed part of the foil by forming an etching resist on the foil. In this case, the laminating step has steps of dividing the step into at least twice or more under thermocompression bonding conditions having different heating temperatures and multi-stage thermocompression bonding the foil.