| 摘要 |
A device for processing a wafer according to the present invention comprises an upper roller, a lower roller, and a carrier. The upper roller comprises a first upper roller and a second upper roller which are separated to each other and comprises a first polishing pad on the outer circumference surface of the first upper roller and the second upper roller in order that the polishing pad is positioned between the first upper roller and the second upper roller. The lower roller is installed in the lower unit of the upper roller; comprises a first lower roller and a second lower roller which are separated to each other; and comprises a second polishing pad on the outer circumference surface of the first lower roller and the second lower roller in order that the polishing pad is positioned between the first lower roller and the second lower roller. The carrier is positioned between the upper roller and the lower roller and receives the wafer. |
