| 摘要 |
<p>External-connection conductors (41, 42) are formed in a first direction on the back surface of a substrate (20), and wiring conductors (71, 72) are formed in a second direction on the front surface of said substrate (20). An insulating layer (60) is formed on the surfaces of the wiring conductors (71, 72) on the opposite side thereof from the substrate (20). Component-mounting conductors (31, 32) are formed on the surface of the insulating layer (60) on the opposite side thereof from the wiring conductors (71, 72). One of the component-mounting conductors (31) is electrically connected to one of the wiring conductors (71), which is electrically connected to one of the external-connection conductors (41) via a conductive film (521) on the inside wall surface of a hole (511) formed between the regions of the substrate (20) in which the component-mounting conductors (31, 32) are formed. The other component-mounting conductor (32) is electrically connected to the other wiring connector (72), which is electrically connected to the other external-connection conductor (42) via a conductive film (522) on the inside wall surface of another hole (512) formed between the regions of the substrate (20) in which the component-mounting conductors (31, 32) are formed.</p> |
