| 摘要 |
The present invention is to provide a machining method for easily controlling a machining region and a machining apparatus. According to the present invention, in a machining method for performing an etching process on an object, a laser beam of wavelength of transparency on the object and the holding table from an opposite side and the holding surface of the holding table is plated and emitted to the inner part of the process region of the object while an etching gas is supplied to an etching chamber accommodating the object maintained on the holding surface of a holding table. Therefore, etching is carried out by exciting the process region. |
