| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive electronic circuit device for an automobile having superiority in thermal dissipation and water-resistance without delaminations and cracks between a mold resin and members due to a thermal stress. SOLUTION: The device comprises an electronic circuit 4 including a circuit board 6 on which an electronic circuit component is mounted, a leadframe 2 for mounting the electronic circuit 4, a flange portion 2c provided on a part of the leadframe 2, and a lead 2a. The circuit board, leadframe, lead and flange except a part of the lead and flange are encapsulated by a mold resin by one operation. A protrusion 7 is formed around the center on the upper surface of the leadframe 2 for supporting only the center part of the circuit board, and the backside of the center part of the circuit board 6 is bonded to the protrusion 7. |
