| 摘要 |
PROBLEM TO BE SOLVED: To prevent damages to a semiconductor chip due to press-fitting of a support electrode into a heat radiating plate, by making a hardness of the supporting electrode higher than that of the heat-radiating plate. SOLUTION: A semiconductor device is provided with a support electrode 3 for bonding to support a semiconductor chip 1, using a high-temperature solder with a thermal expansion relieving electrode 5 provided via intermediate position, and a heat-radiating plate 9a having a hole to which the electrode 3a is press-fitted to radiate heat generated in the chip 1 through the plate 9a. In the device, the hardness of the electrode 3a is set higher than that of the plate 9a. |
