| 摘要 |
The purpose of the present invention is to improve product reliability when performing resin sealing that partially exposes a part of a semiconductor element. In order to fulfill said purpose, this thermal airflow sensor is provided with the following: a thin section; a heating resistor provided on said thin section; a semiconductor substrate that has resistance temperature detectors provided upstream and downstream of the heating resistor; an organic protective film provided on the semiconductor substrate; and a resin that seals the semiconductor substrate. Said resin has an exposing section that partially exposes a region that includes the aforementioned thin section. This thermal airflow sensor is characterized in that the organic protective film is provided so as to enclose the heating resistor and the outer edge of the organic protective film is located outwards of the thin section and in the exposing section. |
