| 摘要 |
The present invention relates to an apparatus for treating the surface of large area injection molded complex plasma capable of stably placing a large and high weight injection mold, treating a surface, evenly maintaining the dispersion of temperature in a process chamber by responding to the large and high weight injection mold, optimizing the injection of gas and the location of a pump in order to evenly disperse gas in the process chamber, and having the optimal and uniform effect of surface treatment by controlling micro pulse power. The present invention includes: a base frame; a process chamber which is installed in the upper part of the base frame, is hollow, has an opening on one end part, and has a rail for a jig formed therein in the lengthwise direction; a base rail installed on the bottom in the opening of the process chamber; a moving frame moving in the upper part of the base rail along a rail; a cover which is installed in the upper part of the moving frame and is formed so as to open and close the opening of the process chamber; and a jig which has one end fixated to the cover and has a workpiece installed on the upper part by having a roller placed on the rail for a jig in the lower part of the other end. |
