发明名称 ADHEREND REMOVING INSTRUMENT
摘要 PROBLEM TO BE SOLVED: To provide an adherend removing instrument capable of simply and certainly folding and removing the adherend pasted on a plastic part along with a plastic portion on which the adherend is pasted. SOLUTION: The adherend removing instrument is equipped with a first grip 16 having a first grasping member 12 fixed thereto, the first handle 20 connected to the first grip 16 through a first fulcrum P1, a second grip 18 having a second grasping member 14 fixed thereto, a second handle 24 having the second grip 18 fixed thereto and supporting the first grip 16 in a rotatable manner through a second fulcrum P2 and a locking mechanism part 30 for holding such a state that the adherend and the plastic portion on which the adherend is pasted are held between the first and second grasping members 12 and 14 by rotating the first grip 16 centering around the second fulcrum P2 by grasping the first and second handles 20 and 24.
申请公布号 JP2002321219(A) 申请公布日期 2002.11.05
申请号 JP20010128375 申请日期 2001.04.25
申请人 SONY CORP 发明人 NAKAMURA HIDEKAZU;HORI HISAYOSHI
分类号 B25B7/02;B29B17/02;(IPC1-7):B29B17/02 主分类号 B25B7/02
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