发明名称 DETECTION OF DEFECTS EMBEDDED IN NOISE FOR INSPECTION IN SEMICONDUCTOR MANUFACTURING
摘要 One embodiment relates to an apparatus for detecting defects on a manufactured substrate. The apparatus includes an imaging tool arranged to obtain image frames from the manufactured substrate. The apparatus further includes a data processing system which includes computer-readable code configured to compute features for pixels in an image frame and divide the pixels in the image frame into feature-defined groups of pixels. The computer-readable code is further configured to select a feature-defined group, and generate a multi-dimensional feature distribution for the selected feature-defined group. Another embodiment relates to a method of detecting defects from a test images frame and multiple reference image frames. Other embodiments, aspects, and features are also disclosed.
申请公布号 WO2014004682(A1) 申请公布日期 2014.01.03
申请号 WO2013US47909 申请日期 2013.06.26
申请人 KLA-TENCOR CORPORATION 发明人 LIN, JASON Z
分类号 H01L21/66 主分类号 H01L21/66
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