| 摘要 |
<p>In a method of manufacturing a chip resistor (2), a semi-product (43) is formed by sandwiching an electric-insulating material layer (5) between an electric-conducting material layer (41) and a heat-dissipating material layer (42). Resistor sections (46) arranged in an array on the semi-product (43) are formed by forming longitudinal first slots (44) and transverse second slots (45) through the semi-product (43). Slits are formed on a first layer (411) of each resistor section to form a resistor main body (21). A dividing slot (231) is formed on a second layer (421) of each resistor section (46). Electrodes (24) are formed to be electrically connected to opposite ends (214) of the resistor main body (21). The resistor sections (46) are trimmed from the semi-product (43) to obtain the chip resistors (2). [Reference numerals] (S01) Form a semi-product; (S011) Coat a heat-conductive polymer material on one of an electric-conducting material layer and a heat-dissipating material layer; (S012) Stack the other one of the electric-conducting material layer and the heat-dissipating material layer on the heat-conductive polymer material; (S013) Heat the electric-conducting material layer and the heat-dissipating material layer under a vacuum condition; (S02) Form resistor sections arranged in an array on the semi-product; (S021) Form longitudinally extending first slots through the semi-product; (S022) Form longitudinally extending second slots through the semi-product; (S03) Form slits on a first layer of each resistor section to form a resistor main body; (S04) Form a slot on a second layer of each resistor section to form a heat dissipating layer; (S05) Form two electrodes electrically and respectively connected to opposite ends of the resistor main body; (S06) Trim the resistor sections from the semi-product to obtain chip resistors</p> |
