发明名称 Semiconductor device and method of fabricating the same
摘要 In a semiconductor device including a laminate of a first insulating layer, a crystalline semiconductor layer, and a second insulating layer, characteristics of the device are improved by determining its structure in view of stress balance. In the semiconductor device including an active layer of the crystalline semiconductor layer having tensile stress on a substrate, tensile stress is given to the first insulating layer formed to be in close contact with a surface of the semiconductor layer at a substrate side, and compressive stress is given to the second insulating layer formed to be in close contact with a surface of the semiconductor layer at a side opposite to the substrate side.
申请公布号 US2002167007(A1) 申请公布日期 2002.11.14
申请号 US20020093313 申请日期 2002.03.07
申请人 发明人 YAMAZAKI SHUNPEI;ASAMI TAKETOMI;TAKAYAMA TORU;KAWASAKI RITSUKO;ADACHI HIROKI;SAKAMOTO NAOYA;HAYAKAWA MASAHIKO;SHIBATA HIROSHI;ARAI YASUYUKI
分类号 H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L31/036;H01L23/58 主分类号 H01L21/336
代理机构 代理人
主权项
地址