SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

The present invention has a chip-dicing step (M13) for dicing an LED wafer (50) on a dicing sheet (60) into a plurality of LED chips (55), a transfer step (M14) for transferring the diced LED chips onto another first expanding sheet (70), and a first expanding step (M15) for expanding the first expanding sheet and providing gaps (S1) among the LED chips, thereby preventing the positions of the semiconductor chips from shifting after expanding the sheet.