发明名称 PHOTORESISTS COMPRISING AMIDE COMPONENT
摘要 <p>The present invention provides a novel photoresist composition including an amide group and multiple hydroxyl groups. A desirable photoresist of the present invention may include a resin with a photoacid-labile group, a photoacid generation compound, and an amide component having multiple hydroxyl groups capable of reducing the diffusion of an undesirable photoacid from the non-exposure area of a photoresist coating layer.</p>
申请公布号 KR20140000657(A) 申请公布日期 2014.01.03
申请号 KR20130073103 申请日期 2013.06.25
申请人 ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C. 发明人 LIU CONG;WU CHUNYI;POHLERS GERHARD;PROKOPOWICZ GREGORY P.;LI MINGQI;XU CHENG BAI
分类号 G03F7/004;G03F7/26 主分类号 G03F7/004
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