CIRCUIT BOARD MULTI-FUNCTIONAL HOLE SYSTEM AND METHOD

摘要

A method and system for constructing a printed circuit board with multifunctional holes. A first conductive material is deposited into a hole in a substrate to form a first plating on an inner surface of the hole. At least one outer portion of the hole is modified to have a larger diameter than the original hole and to remove the first conductive material from that outer portion. A seed material is deposited into the modified hole. An etchant is applied to the hole to non-mechanically remove the first conductive material from the unmodified portion of the hole. Another conductive material is deposited to into the modified hole that adheres to the seed material in the modified outer portion via to form a second plating at the outer portion.