| 摘要 |
The mold (7) includes molding plates (70) with heating and end plates (71, 72). The plates are heated, and moved by a drive. A small pouch (100) is made. A frame (1) is selected, its thickness being equal to that of a card. It is located on a film (2). The electronic circuit (4) is placed against the lower edge (10) of the frame. A second film (2') is located on the frame and fixed to its lower edges (10) and sides (11, 12). A resin (5) is prepared. A predefined volume of it is introduced into the pouch (100). The second film is fixed to the upper edge (13) of the frame, closing the pouch (100) over its entire periphery. The pouch is positioned on a support (6) holding it vertically during a residence time required for the resin. When the mold is hot and the residence time of the resin has expired, the pouches (100) are positioned in the mold (7) against the molding plates (70). The drive is operated, bringing the plates into mutual contact. The pockets are left in the closed mold, maintaining the temperature during the time required for resin polymerization. The mold is then opened; the pouches are removed. Once the resin has set, the pouches are cut away in the shape of the cards required. The films (2, 2') are pulled off. Variant methods are proposed to transfer decoration onto the card from the films. An adhered band holds the electronics in place on bridging sections, during the operation. The resin is compatible with electronic component encapsulation. A system of inflatables within the plates, applies pressure. Inserted spacers define card thickness. The molding equipment is further detailed. An Independent claim is included for the mold used.
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