| 摘要 |
The present invention relates to a light emitting diode package and a method for manufacturing the same, and the objective of the present invention is to provide the light emitting diode package and the method for manufacturing the same, which can significantly reduce manufacturing costs and can maximize radiation performance by replacing a plastic housing molding or a ceramic housing molding, which surround existing light emitting diodes and function as a refractor, with a metal-type housing molding. To this end, the light emitting diode package for mounting a light emitting diode chip comprises: a base portion which provides a mounting space having the light emitting diode chip mounted thereon; and a lead frame which comprises a housing portion having one end of which is bent and connected to one end of the base portion and is stacked on one side of the base portion. |
