发明名称 INSERTION TOOL FOR MEMORY MODULES
摘要 An embodiment is a method and apparatus to provide an insertion tool for a memory module. First and second spacers are located at a predetermined distance. Each has a flat top surface and a bottom surface with a longitudinal opening having a narrow width that accommodates a first thickness of a printed circuit board (PCB). First and second guides are attached to sides of the first and second spacers, respectively, such that a guide distance between the first and second guides corresponds to a combined thickness of the first thickness and side thicknesses of a socket connector into which the PCB is inserted. Each of the first and second guides has two end portions that extend downward by a height.
申请公布号 US2014004734(A1) 申请公布日期 2014.01.02
申请号 US201213535316 申请日期 2012.06.27
申请人 HOANG PHAN F. 发明人 HOANG PHAN F.
分类号 H01R13/64;H05K13/04 主分类号 H01R13/64
代理机构 代理人
主权项
地址