发明名称 SIDE LOCK ASSEMBLY FOR HEAT SINK AND MEMORY MODULES
摘要 An embodiment is a method and apparatus to provide a side lock assembly for a memory module with a heat sink A side clip has a clip base attached to a socket connector and a first clip member and a second clip member extending from the clip base. The first clip member has a terminal for attaching to a printed circuit board. The second clip member is spaced in parallel from the first member to form an opening. A side lock has a lock base and first and second lock members that form a slot. The first and second lock members flank the second clip member such that the second clip member fits into the slot and the first lock member fits into the opening.
申请公布号 US2014002997(A1) 申请公布日期 2014.01.02
申请号 US201213535305 申请日期 2012.06.27
申请人 HOANG PHAN F. 发明人 HOANG PHAN F.
分类号 H05K7/20;H01R13/62 主分类号 H05K7/20
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