发明名称 |
CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES |
摘要 |
A chip package is provided, the chip package including: a chip carrier; a chip disposed over and electrically connected to a chip carrier top side; an electrically insulating material disposed over and at least partially surrounding the chip; one or more electrically conductive contact regions formed over the electrically insulating material and in electrical connection with the chip; a further electrically insulating material disposed over a chip carrier bottom side; wherein an electrically conductive contact region on the chip carrier bottom side is released from the further electrically insulating material. |
申请公布号 |
US2014001622(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201213534001 |
申请日期 |
2012.06.27 |
申请人 |
BAUER MICHAEL;HAIMERL ALFRED;KESSLER ANGELA;SCHOBER WOLFGANG;INFINEON TECHNOLOGIES AG |
发明人 |
BAUER MICHAEL;HAIMERL ALFRED;KESSLER ANGELA;SCHOBER WOLFGANG |
分类号 |
H01L23/48;H01L21/58;H01L23/495 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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