| 摘要 |
Disclosed is an inspection apparatus for a semiconductor device, which is to inspect an electric characteristic of an inspective object having a plurality of electric inspective contact points. The inspection apparatus includes a socket assembly which includes a plurality of probe pins retractable in a longitudinal direction, a probe pin supporter supporting the probe pins in parallel with each other, and a socket board including a plurality of fixed contact points a first end portion of the probe pins, and an inspective object carrier which includes an inspective object accommodating portion accommodating the inspective object so that the inspective contact points face toward a second end portion of the probe pins, and a floor member interposed between the inspective object and the probe pin supporter and including probe holes penetrated corresponding to the inspective contact points and passing the second end portion of the probe pin therethrough. |
