发明名称 RELAMPABLE LED STRUCTURE
摘要 A lighting assembly includes a plurality of LEDs mounted on a flexible substrate such as a printed circuit board. The printed circuit board is bonded thermally and physically to a thicker, rigid substrate, such as a metal plate, to form a board assembly. The rigid substrate is made of a thermally conductive material, such as aluminum. As such, the board assembly provides structural rigidity and thermal conductance. Bonding the metal plate to the printed circuit board also provides improved thermal communication over the entire overlapping areas of the metal plate and printed circuit board. The board assembly is fastened to a heat exchanging device, such as an evaporator. The rigid substrate of the board assembly provides continuous contact of the substrate with the heat exchanging device in response to a reduced number of fastening points.
申请公布号 US2014001496(A1) 申请公布日期 2014.01.02
申请号 US201313921044 申请日期 2013.06.18
申请人 FLEXTRONICS AP, LLC 发明人 MUSSER JORDON;STRATAS CHRIS
分类号 H01L33/64 主分类号 H01L33/64
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