发明名称 RESIN COMPOSITION FOR OPTICAL WAVEGUIDE, DRY FILM, OPTICAL WAVEGUIDE, AND PHOTOELECTRIC COMPOSITE WIRING BOARD USING SAME
摘要 Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.
申请公布号 US2014004321(A1) 申请公布日期 2014.01.02
申请号 US201214005242 申请日期 2012.03.30
申请人 KONDO NAOYUKI;YASHIRO JUNKO;NAKASIBA TOORU;HASHIMOTO SHINJI;PANASONIC CORPORATION 发明人 KONDO NAOYUKI;YASHIRO JUNKO;NAKASIBA TOORU;HASHIMOTO SHINJI
分类号 G02B1/04 主分类号 G02B1/04
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