| 摘要 |
An acoustic wave device built-in module includes: a multilayer wiring board formed by stacking an insulating layer and a wiring layer; an acoustic wave device embedded in the multilayer wiring board; and an electronic component located on the multilayer wiring board and electrically coupled to the acoustic wave device, wherein the acoustic wave device includes: an electrode that is located on a substrate and excites an acoustic wave; and a sealing portion that includes a frame body located on the substrate so as to surround the electrode and a lid located on the frame body so as to form an air space above the electrode, and the lid is recessed toward the substrate. |
