| 发明名称 |
Voids in Interconnect Structures and Methods for Forming the Same |
| 摘要 |
A device includes a dielectric layer, a passive device including a portion in the dielectric layer, and a plurality of voids in the dielectric layer and encircling the passive device. |
| 申请公布号 |
US2014001597(A1) |
申请公布日期 |
2014.01.02 |
| 申请号 |
US201213539121 |
申请日期 |
2012.06.29 |
| 申请人 |
HUANG JIUN-JIE;WANG LING-SUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG JIUN-JIE;WANG LING-SUNG |
| 分类号 |
H01L29/02;H01L21/02 |
主分类号 |
H01L29/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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