POLISHING PAD AND CHEMICAL MECHANICAL POLISHING APPARATUS FOR POLISHING A WORKPIECE, AND METHOD OF POLISHING A WORKPIECE USING THE CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

A polishing pad for polishing a workpiece to a mirror finish is attached to a rotatable polishing table of a chemical mechanical polishing apparatus. The workpiece, such as a metal body, is held by a carrier and pressed against the polishing pad. This polishing pad includes: an elastic pad having a polishing surface; a deformable base layer that supports the elastic pad; and an adhesive layer that joins the elastic pad to the base layer.