| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having such a structure as to allow easy visual inspection from the outside for the connection between a semiconductor chip and electrodes of a wiring board via ball bumps, and also to provide its manufacturing method. <P>SOLUTION: Each electrode pad 21 of the semiconductor chip 23 is provided with an extended portion 21b extended toward the periphery of the semiconductor chip 23. When connecting the semiconductor chip 23 and the wiring board 24 via the ball bumps 22 after forming the ball bumps 22 on the electrode pads 21, molten ball bumps 22 are so guided as to flow toward the periphery of the semiconductor chip. Due to this structure, the semiconductor device can be visually inspected from the outside easily after being fabricated. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
