| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cooling device for a computer, capable of achieving pressure absorption effect utilizing elasticity of a heat discharge plate, reducing the number of parts, and lowering manufacturing cost. <P>SOLUTION: The cooling device comprises a heat-conductive piece 2, and a heat discharge plate 3. Using the heat discharge plate 3 reduces the total volume of the cooling device, thus increasing space availability by achieving demagnification. A direct modifying part having elasticity is provided on the heat radiation plate 3, to absorb the pressure of the heat radiation plate applied to the heat conductive piece and heating device, when the heat radiation plate is fastened to a substrate 1 with a screw. Accordingly, a specially designed spring which has been necessary in the prior art is not required, achieving a simpler structure, less parts, and lower manufacturing cost. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
