发明名称 APPARATUS FOR BLANKING PRINTED CIRCUIT BOARD
摘要 A device for punching a base plate according to the present invention includes a lower mold on which a base plate to be punched is placed; an upper mold punching the base plate while vertically moving from the upper part of the lower mold; a guide unit guiding the upper mold to a predetermined position of the lower mold when the upper mold descends by being formed in the lower part of the upper mold and being controlled whether it is protruding or not from the bottom surface of the upper mold as the length of the guide unit can be controlled; and a guide groove formed in the upper part of the lower mold to correspond to the guide unit and in which the guide unit is inserted when the upper mold descends.
申请公布号 KR20140000035(A) 申请公布日期 2014.01.02
申请号 KR20120067268 申请日期 2012.06.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, JUNG WOO
分类号 B26F1/40;H05K3/00 主分类号 B26F1/40
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