| 摘要 |
<p>PURPOSE: A semiconductor package having functions of wireless signal transmission and wireless power driving and heat dissipation is provided to improve radiation effect by supplying power to a thermoelectric device module in wireless and removing a metal line. CONSTITUTION: In a semiconductor package having functions of wireless signal transmission and wireless power driving and heat dissipation, a base part(10) comprises a first side(12) a second side(14). A thermoelectric part(70) comprises an electricity receiver and a thermoelectric element. A wireless power supply unit(30) provides power to the base part and a semiconductor chip mounted in a mounting region. The wireless power supply unit receives power signal from outside in wireless. The wireless power supply unit comprises a power transmitter(200) and an electricity receiver(300).</p> |
