发明名称 ONE COMPONENT EPOXY RESIN COMPOSITION
摘要 Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin.
申请公布号 KR20140000245(A) 申请公布日期 2014.01.02
申请号 KR20137012690 申请日期 2011.11.18
申请人 HENKEL CORPORATION 发明人 CHEN CHUNFU
分类号 C08G59/50;C08G59/56;C08G59/62;C08L63/00 主分类号 C08G59/50
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