| 摘要 |
An embodiment is a method and apparatus to provide thermal management for a memory module with a heat sink. A top element has a first portion with a top area covering a substantial top surface of the memory module and a second portion bent at an angle that is substantially perpendicular to the first portion and having a height that is approximately equal to thickness of the memory module. A bottom element has a third portion with a bottom area covering a substantial bottom surface of a memory module and a fourth portion bent at an angle that is substantially perpendicular to the third portion and having a height that is approximately equal to the thickness of the memory module. The fourth portion is attached to the second portion. |
