| 摘要 |
<p>The present invention relates to an electronic component module on which a resin layer is formed on a writing board sealing a connection terminal member and in which the connection terminal member on a column and on a conductive land of the wiring substrate is intervening and joined. The purpose of the present invention is to suppress joining materials in a joining part in a reflow process for packaging an object to a package substrate to be discharged. To achieve the purpose of the present invention, a metal compound producing area (25) in which at least a metal compound of Cu-Sn group, M-Sn (M is Ni and/or Mn) group, and Cu-M-Su group in a joining part (10) of a connection terminal member (6) and a conductive land (7) produced should be located on the side of the connection terminal member (6). If the metal compound producing area (25) is divided into 100 mass by 10 mass and 10 mass horizontally and vertically respectively, the rate of the number of mass containing at least two types of metal compound of which the elements of organizing the entire mass excluding a mass containing Sn metal components per mass are different is more than 70%.</p> |
